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Zonal Yield Reporting- Study which regions of the wafer have yield issues, and instantly identify and differentiate between random and systematic yield problems.
yieldWerx enables you to define the zones of interest, prior to running the analysis. |
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Wafer Probe Correlation & Analysis Reports -> Suite of analysis reports enabling operators & engineers to efficiently correlate different test runs of data against each other. The report enables instant identification of yield issues in cases where wafers & final testing occurs in multiple manufacturing & test sites.
Quickly able to ensure that there are no test program or test equipment related issues when setups or test program changes are made. Saves valuable yield and test time.
The reports support both Parameter-to-Parameter correlation as well as Bin correlation. T-Test is one of the options available in both report types. |
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Full Wafer Correlation - In this case the wafer is probed on the initial tester in its entirety. The STDF file is loaded to yieldWerx and marked as the base line data or 'golden' data. The wafer is then retested on the second tester, again in its entirety, and the resulting STDF file loaded to yieldWerx.
The newly loaded STDF file is then analyzed in light of the baseline data, and compared to see whether or not the data correlates.
Allows the user to generate multiple analysis reports, and take appropriate actions. |
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Partial Wafer Correlation - This is similar to the Full Wafer Correlation & Analysis Report, but takes into account that the wafer can be probed at any point. Because correlation wafers or die can only be probed a certain number of times before probe marks on the probe pads become an issue, operators are limited to only probe portions of the wafer. These partial probe results are then compared with the baseline data to see if the data correlates. This report extends the life of a correlation wafer, as well as cuts down on test time when performing correlation runs. |
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Final Test Data Correlation & Analysis Reports -> This report is similar in nature to Wafer Correlation and Analysis Reports, but has been developed to do the same for Final Packaged Units. For example: The tester will be running in final test mode, and may be performing single or dual site testing. Some golden units are identified to be used for the correlation run. For example there are 4 units that are going to be used for correlation purposes in single site test mode. The 4 units will be tested and have 50 tests performed on them, on both testers. 2 of the resulting STDF files will have data for the 5 units and 50 test parameters. If the units are cycled through more than once, the unit number will just be incremented by 1. The reports and analysis routines then check and compare the resulting BIN, SOFTBIN and test parameters for the same die across the two STDF files. If there are any discrepancies, these will be highlighted in the report. |
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Yield Analysis Reports - yieldWerx enables Product Engineers to identify yield losses due to potential problems with test related equipment. These could range from tester setup related issues to probe card or load board related issues.
yieldWerx Analysis Reports highlights yield variations for wafers from the same lot, and final test units from the same lot, across different test equipment.
The reports can be used to highlight issues for lots & wafers of the same device, that are being tested using the same test algorithms (i.e. not necessarily the same lot).
The reports can also be used to identify site & socket issues when testing multi site. Example: sites 1-3 are yielding, but site 4 is always failing.
Saves valuable yield and test time. Improves quality; die & units can be binned incorrectly. Reports can be automatically run highlighting issues that can cause the engineer & operator to stop the tester, and make the corrections, re-probe the wafers & units, and recover yield. |
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yieldWerx Database - Easily upload hundreds of STDF test data files from across Work Centers, Test Programs, Lots, and Wafers, and run reports that compare test results across Wafers and Lots. Simple Windows drill down capabilities allow you to maintain your Die and Wafer Genealogy. |
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Parametric Wafer Map - You can generate wafer maps for test parameters and visually see the distribution of results by die location. The report can aggregate data from multiple wafers and stack them for cross wafer or lot analysis. The report can also be run for parametric zonal analysis simply by sorting results by wafer. The report can be used for both Parametric as well as Functional test parameters. Options exist to screen/filter data based on Tukey and user defined limits. [Applicable to only Wafer Probe Data] |
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Stacked Wafer Map - This report is similar to the single wafer map report, however instead of showing the wafers as individual maps, the output is a stacked map representation of all the wafers for either Bins or Soft Bins. The report can be run for multiple wafers and multiple lots. You can then drill down to the raw data by selecting any of the die on the wafer. [Applicable to only Wafer Probe Data] |
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Wafer Map - This report visually generates a representation of a wafer showing either Bins or Soft Bins. The report can be run for multiple wafers and multiple lots. , The output of the reports can be aggregated by bin population/wafer yields by wafer, lot, or test program. You can compare multiple wafer maps using the wafer map thumb nail galleries to see if there are any repeating patterns across wafers. [Applicable to only Wafer Probe Data] |
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Parametric Histogram - Generates histograms for a given test parameter and represents the data as a series of classes. The report can aggregate data from multiple wafers and stack them for cross wafer or lot analysis. The report can be used for both Parametric as well as Functional test parameters. Options exist to filter data based on Tukey, user defined limits, as well as user definable classes for the data. [Applicable to both Wafer Probe as well as Final Test Data] |
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Bin Histogram - This report allows you to generate Bin summaries for both Wafer probe data as well as Final Test Data based on Bins, Soft Bins, as well as User Defined Bin Groups. The report shows you the yield for the selected data as well as other statistics as a series of bar charts. You can run the report for a single data set, or for a series of selected lots/wafers. [Applicable to both Wafer Probe as well as Final Test Data] |
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Stacked Bin Histogram - This report allows you to generate Bin summaries for both Wafer probe data as well as Final Test Data based on Bins, Soft Bins, as well as User Defined Bin Groups. The report shows you the yield for the selected data as well as other statistics as a series of stacked histograms. You can run the report for a single data set or for a series of selected lots/wafers. [Applicable to both Wafer Probe as well as Final Test Data] |
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Box Plots - This report allows you to select two parameters and plot them against each other for as many wafers/lots as you select. The data plotted provides visualizations to see if there is any correlation between the two. Again users are allowed to select limits and apply filters as needed. [Applicable to both Wafer Probe as well as Final Test Data] |
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Parametric Trend - This report allows you to generate trend charts for either a single parameter or groups of parameters where the units of measurements are similar. Graphically allows you to visualize trends/relationships as well as other key statistics. The report can be run for a single data set or a series of lots/wafers. You can filter, as well as group, data with a wide range of options [Applicable to both Wafer Probe as well as Final Test Data] |
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Data Reports:
Parametric Failure Report - A very simple report that shows you the top most failing tests based on limits included in the data source or user specified. Useful for showing you what tests are failing the most and for you to take corrective action on - conversely you can also see which tests are failing the least and decide to modify the test program to take the non critical ones out to save test times. [Applicable to both Wafer Probe as well as Final Test Data]
Data Summary: Statistically analyze the results for any test parameter, and view the Mean, Standard Deviation, Cp, Cpk, Yield, and other statistical results for selected test parameters, wafers and or lots. [Applicable to both Wafer Probe as well as Final Test Data] |
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XY Scatter - This report allows you to select two parameters and plot them against each other for as many wafers/lots as you select. The data plotted provides visualizations to see if there is any correlation between the two. Again users are allowed to select limits and apply filters as needed. [Applicable to both Wafer Probe as well as Final Test Data] |
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Smart Labels - Smart Data Labels allow for access to detailed data on the die plotted, without cluttering the graph too much. |
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Technology: yieldWerx is developed with Microsoft .Net Technology
Database: Powered by Microsoft SQL Server Database
Export Reports to Microsoft Excel. You can export results to Microsoft Excel from any yieldWerx Report |
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Interactive Charts. yieldWerx Interactive Reports allow you zoom in/out on reports, drill down into test parameter results for a die by clicking on the wafer map, and visually grouping the data by lot or wafer |
